By Michael Eick, Helmut Graeb (auth.), Mourad Fakhfakh, Esteban Tlelo-Cuautle, Rafael Castro-Lopez (eds.)

Despite the truth that within the electronic area, designers can take complete merits of IPs and layout automation instruments to synthesize and layout very complicated structures, the analog designers’ job continues to be regarded as a ‘handcraft’, bulky and intensely time eating procedure. therefore, great efforts are being deployed to strengthen new layout methodologies within the analog/RF and mixed-signal domain names.

This ebook collects sixteen state of the art contributions dedicated to the subject of systematic layout of analog, RF and combined sign circuits. Divided within the elements Methodologies and methods fresh theories, synthesis recommendations and layout methodologies, in addition to new sizing methods within the box of sturdy analog and combined sign layout automation are provided for researchers and R/D engineers.

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1 Introduction In recent years, design methodologies for high-frequency and mm-wave circuits have attracted a lot of attention. In particular, research and applications on RF building blocks for 40 GHz to 120 GHz and beyond are increasing drastically [1]. Existing RF IC synthesis methodologies, however, focus on low-GHz cases [2,3]. com M. Fakhfakh et al. ): Analog/RF & Mixed-Signal Circuit Sys. Design, LNEE 233, pp. 27–52. 1007/978-3-642-36329-0_2 © Springer-Verlag Berlin Heidelberg 2013 28 B.

Differential Evolution. A Practical Approach to Global Optimization. : Data Mining Methods and Models. John Wiley & Sons (2006) 52 B. Liu and G. : An empirical comparison of supervised learning algorithms. In: Proc. of the International Conference on Machine Learning, pp. : Large Sample Properties of Simulations Using Latin Hypercube Sampling. : ANN- and PSO-Based Synthesis of On-Chip Spiral Inductors for RF ICs. : Efficient Global Optimization of Expensive Black-Box Functions. : Neural computing: theory and practice.

The ranges of the design variables are dinp, dins ∈ [20,150] , wp , ws ∈ [5,10] (all in μ m ). 85, the quality factor of the primary inductor Q1 > 10, the quality factor of the secondary inductor Q2 > 10. The output load impedance is 25 Ω , which is the input resistance of the following stage. The specifications of the input impedance (at 60GHz) are Re( Z in ) ∈ [10, 20] and Im( Z in ) ∈ [10, 25] ( Ω ), which is the required optimal load impedance of the driver stage. The optimization goal is to maximize the power transfer efficiency (PTE).

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